LITE TKBN25
semi-crystalline
Properties
Semi-crystalline thermoplastic PEEK film filled with up to 25 % boron nitride
General properties:
General properties:
- higher thermal conductivity
- lower coefficient of thermal expansion
- Density (ISO1183): 1,3 g/cm³
- Glass transition temperature (ISO11357): 143 °C
- Melting temperature: 343 °C
- Tensile strength at 23°C (ISO527): 130 N/mm²
- Tensile elongation at 23°C (ISO527): 170 %
- Tensile modulus (ISO527): 3200 N/mm²
- Dielectric strength (IEC243): 180 kV/mm
- Thermal conductivity x 10² (ASTM E1461-13): approx. 50 W/mK
Typical applications
- electrically insulating and thermal conductive films
- substrates for sensors